Leading manufacturer and supplier 256×192 Thermal Imaging Camera Module cores

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♦ Overview

M10-256 integrated infrared thermal imaging core is a high-performance infrared thermal imaging product developed on the basis of a wafer-grade encapsulated uncooled vanadium oxide infrared detector. USB interface output is adopted for the product, for which it boasts multiple control interfaces and is adaptable to various intelligent processing platforms. With its high performance, low power consumption, small size, and a feature of easy development and integration, the product is suitable for secondary development needs of various infrared temperature measuring products. 

♦ specification

M10-256 is a micro infrared thermal imaging camera module of the latest generation, with a very small size due to its high density integrated circuit design. The module adopt split-type design, the lens and interface board are connected by flat cable, plus a wafer-grade vanadium oxide detector with very low power consumption. The module is integrated with 3.2mm lens and shutter, equipped with USB interface board, so it can be developed into different devices. Control protocol or SDK is also provided for secondary development.

Small size, with the front lens of only (13 * 13 * 8) mm and the interface board of (23.5 * 15.3) mm
Low power consumption up to 640mW;
A resolution of 256 * 192 provides high-definition thermal image;
Equipped with USB interface board, it can be developed into different products;
Split-type design is adopted for the lens and interface board, which are connected by FPC flat cable;